ISO/IEC TR 19446:2015
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
OVERVIEW
IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation.
These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition:
- inclusion of new Clause 3;
- expansion of 6.7 on solder reflow;
- inclusion of explanatory notes and clarifications.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2015 |
| No. of Pages | 25 |
| ICS Classification | 35.240.15 Identification cards. Chip cards. Biometrics |
| Committee | ISO/IEC JTC 1/SC 17 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |