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Singapore Standards Package/Series ISO IEC

2561 Results. Sorry, we cannot find result for ("vellfire vs 2020的差别") , perhaps what you trying to look for are …

IEC 60061-4C:1994 [Current]

Third supplement - Lamp caps and holders together with gauges for the control of interchangeability and safety. Part 4: Guidelines and general information

IEC 60061-4D:1995 [Current]

Fourth supplement - Lamp caps and holders together with gauges for the control of interchangeability and safety. Part 4: Guidelines and general information

IEC 60061A:1965 [Revised]

First supplement - Lamp caps and holders together with gauges for the control of interchangeability and safety

IEC 60061B:1966 [Revised]

Second supplement Lamp caps and holders together with gauges for the control of interchangeability and safety

IEC 60061B:1966/AMD1:1966 [Revised]

Amendment 1 - Lamp caps and holders together with gauges for the control of interchangeability and safety

IEC 60061B:1966/AMD2:1966 [Revised]

Amendment 2 - Lamp caps and holders together with gauges for the control of interchangeability and safety

IEC 60061C:1967 [Revised]

Third supplement - Lamp caps and holders together with gauges for the control of interchangeability and safety

IEC 60062:2004 [Revised]

Marking codes for resistors and capacitors

IEC 60068-2-69:2017 [Current]

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

...VSO 40 c QFP 48 c QFP 160 c PLCC 44 c PLCC 84 c Vertical or 20 to 45 1D, 1E, 1F 1J, 1K, 1L Cylindrical SMD N/A Horizontal, vertical or 20 to 45 1A, 1B, 1C SOD 80 N/A Vertical or 20 to 45 1B, 1C Not recommended for sizes below 160...
...VSO QFP, SOP 2D 0,20 Remove sufficient leads to avoid bridging between tested leads PLCC, SOJ Horizontal 2E 0,10 QFN N/A Horizontal 2H d 0,10 2 25 Caution from bridging Cylindrical SMD N/A Horizontal or vertical 2A, 2B 0,25 4 200 ...
...SOIC, VSO and QFP devices may require dipping at an angle of 45, since these devices have cut ends which are non-wettable by conventional test fluxes...

IEC 60068-2-69:2017+AMD1:2019 CSV [Current]

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

...VSO 40 c QFP 48 c QFP 160 c PLCC 44 c PLCC 84 c Vertical or 20 to 45 1D, 1E, 1F 1J, 1K, 1L Cylindrical SMD N/A Horizontal, vertical or 20 to 45 1A, 1B, 1C SOD 80 N/A Vertical or 20 to 45 1B, 1C Not recommended for sizes below 160...
...VSO QFP, SOP 2D 0,20 Remove sufficient leads to avoid bridging between tested leads PLCC, SOJ Horizontal 2E 0,10 QFN N/A Horizontal 2H d 0,10 2 25 Caution from bridging Cylindrical SMD N/A Horizontal or vertical 2A, 2B 0,25 4 200 ...
...SOIC, VSO and QFP devices may require dipping at an angle of 45, since these devices have cut ends which are non-wettable by conventional test fluxes...

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