IEC TR 61189-5-506:2019
[Current]
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
...We can
see some issues on some participants'' data, and in four specific cases, a result from an
individual pattern has been removed, and we make a general observation on participant C...
...ss the gap IEC TR 61189-5-506:2019 IEC 2019 19
Figure 21 Participant G and evidence of a water droplet and the resulting drop
in SIR and dendrite like failure
Figure 22 Participant G and a corrosion defect probably from a flux residue ...
...This film thickness is
very sensitive to the exact temperature and humidity condition at the coupon surface...
