FAQs
IEC 61190-1-2:2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for...
IEC 61190-1-2:2002
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for...
IEC 61189-3:1997
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test...
IEC 61189-3:1997/AMD1:1999
Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies...
IEC 61189-2:1997/COR1:1997
Corrigendum 1 - Test methods for electrical materials, interconnection structures and...
IEC 61189-2:1997
Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test...
IEC 61189-2:1997/AMD1:2000
IEC 61185:1992
Magnetic oxide cores (ETD-cores) intended for use in power supply applications - Dimensions
IEC 61185:1992/AMD1:1995
Amendment 1 - Magnetic oxide cores (ETD-cores) intended for use in power supply applications -...