IEC PAS 63702:2026
Classification of additive manufacturing and 3D-printing processes for electronics
OVERVIEW
IEC PAS 63702:2026 describes the classification of additive manufacturing and 3D-printing processes for electronics.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2026 |
| No. of Pages | 29 |
| ICS Classification | 31.190 Electronic component assemblies |
| Committee | TC 91 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |