IEC 62047-43:2024
Semiconductor devices - Micro-electromechanical devices - Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
OVERVIEW
IEC 62047-43:2024 specifies the test method of electrical characteristics after cyclic bending deformation for flexible electromechanical devices. These devices include passive micro components and active micro components on the flexible film or embedded in the flexible film. The desired in-plane dimensions of the device for the test method ranges typically from 1 mm to 300 mm and the thickness ranges from 10 µm to 1 mm, but these are not limiting values. The test method is so designed as to understand and further visualize the entire performance deterioration behaviour after cyclic bending deformation in a concept of 3D (P-S-N: Performance - Severity of bending - Number of cycles) plot over the loading space of severity of bending and number of repeated cycles. This document is essential to estimate safety margin over the operation period under a certain level of cyclic bending deformation and indispensable for reliable design of the product employing these devices.
COMMENTS
-
PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2024 |
| No. of Pages | 18 |
| ICS Classification | 31.080.99 Other semiconductor devices |
| Committee | TC 47/SC 47F |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |