IEC TR 61760-5-1:2024
Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
OVERVIEW
IEC TR 61760-5-1:2024 describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called “bending cracks”. Area-array components are excluded from the scope of this document.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2024 |
| No. of Pages | 24 |
| ICS Classification | 31.190 Electronic component assemblies |
| Committee | TC 91 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |