IEC 63011-3:2018
Integrated circuits - Three dimensional integrated circuits - Part 3: Model and measurement conditions of through-silicon via
OVERVIEW
IEC 63011-3:2018 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3-D IC.
Power devices, RF devices and micro-electromechanical systems (MEMS) are not in the scope of this document.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2018 |
| No. of Pages | 28 |
| ICS Classification | 31.200 Integrated circuits. Microelectronics |
| Committee | TC 47/SC 47A |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |