IEC 62374-1:2010
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
OVERVIEW
IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2010 |
| No. of Pages | 32 |
| ICS Classification | 31.080.99 Other semiconductor devices |
| Committee | TC 47 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |