IEC 62878-2-602:2021
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
OVERVIEW
IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2021 |
| No. of Pages | 24 |
| ICS Classification | 31.190 Electronic component assemblies 31.180 Printed circuits and boards |
| Committee | TC 91 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |