IEC 61191-3:1998
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
OVERVIEW
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
COMMENTS
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PRODUCT DETAILS
| Status | Revised |
|---|---|
| Edition | 1998 |
| No. of Pages | 31 |
| ICS Classification | 31.240 Mechanical structures for electronic equipment |
| Committee | TC 91 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |