IEC 62137-1-1:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
OVERVIEW
The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2007 |
| No. of Pages | 30 |
| ICS Classification | 31.190 Electronic component assemblies |
| Committee | TC 91 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |