IEC TR 60286-7:2019
Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components
OVERVIEW
IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2019 |
| No. of Pages | 24 |
| ICS Classification | 31.240 Mechanical structures for electronic equipment 31.020 Electronic components in general |
| Committee | TC 40 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |