IEC 62739-1:2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
OVERVIEW
IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2013 |
| No. of Pages | 36 |
| ICS Classification | 31.240 Mechanical structures for electronic equipment 31.190 Electronic component assemblies |
| Committee | TC 91 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |