ISO 9453:2020
Soft solder alloys — Chemical compositions and forms
OVERVIEW
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2020 |
| No. of Pages | 13 |
| ICS Classification | 25.160.50 Brazing and soldering |
| Committee | ISO/TC 44/SC 12 |
| Available for Purchase | For sale in Singapore only |
| Adoption | ISO |