IEC 61190-1-3:2007/AMD1:2010
Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
OVERVIEW
COMMENTS
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PRODUCT DETAILS
| Status | Revised |
|---|---|
| Edition | 2010 |
| No. of Pages | 17 |
| ICS Classification | 31.190 Electronic component assemblies |
| Committee | TC 91 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |