IEC 62878-2-603:2025
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
OVERVIEW
IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM).
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2025 |
| No. of Pages | 25 |
| ICS Classification | 31.180 Printed circuits and boards 31.190 Electronic component assemblies |
| Committee | TC 91 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |