IEC 63251:2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
OVERVIEW
IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2023 |
| No. of Pages | 42 |
| ICS Classification | 31.180 Printed circuits and boards |
| Committee | TC 91 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |