ISO 9455-17:2002
Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
OVERVIEW
ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.
This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
COMMENTS
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PRODUCT DETAILS
| Status | Withdrawn - 10 Jan 2024 |
|---|---|
| Edition | 2002 |
| No. of Pages | 21 |
| ICS Classification | 25.160.50 Brazing and soldering |
| Committee | ISO/TC 44/SC 12 |
| Available for Purchase | For sale in Singapore only |
| Adoption | ISO |