IEC 62047-2:2006
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
OVERVIEW
Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2006 |
| No. of Pages | 25 |
| ICS Classification | 31.080.99 Other semiconductor devices |
| Committee | TC 47/SC 47F |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |