IEC 62047-18:2013
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
OVERVIEW
IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2013 |
| No. of Pages | 26 |
| ICS Classification | 31.080.99 Other semiconductor devices |
| Committee | TC 47/SC 47F |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |