IEC TR 60068-3-12:2007
Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
OVERVIEW
Presents two approaches to establish a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. The presented process window covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components)
COMMENTS
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PRODUCT DETAILS
| Status | Revised |
|---|---|
| Edition | 2007 |
| No. of Pages | 16 |
| ICS Classification | 19.040 Environmental testing |
| Committee | TC 91 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |