IEC 62769-6:2023 RLV
Field Device Integration (FDI®) - Part 6: FDI Technology Mappings
OVERVIEW
IEC 62769-6:2023 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 62769-6:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation of the components FDI® Client and User Interface Plug-in (UIP) in the specified technologies for the WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are individual subparts for the currently supported technologies .NET and HTML5.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2023 |
| No. of Pages | 42 |
| ICS Classification | 35.100.05 Multilayer applications 25.040.40 Industrial process measurement and control |
| Committee | TC 65/SC 65E |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |