IEC 62047-25:2016
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
OVERVIEW
IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2016 |
| No. of Pages | 45 |
| ICS Classification | 31.080.99 Other semiconductor devices |
| Committee | TC 47/SC 47F |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |