IEC 60068-2-58:1989
Environmental testing. Part 2: Tests. Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)
OVERVIEW
Determines solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices. The procedure uses a solder bath and applies only to products designed to withstand short-term immersion in molten solder.
COMMENTS
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PRODUCT DETAILS
| Status | Revised |
|---|---|
| Edition | 1989 |
| No. of Pages | 25 |
| ICS Classification | 19.040 Environmental testing 31.190 Electronic component assemblies |
| Committee | TC 91 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |