IEC 61191-2:1998

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

OVERVIEW

Prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).

COMMENTS

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PRODUCT DETAILS

Status Withdrawn - 02 Jan 2026
Edition 1998
No. of Pages 49
ICS Classification 31.240 Mechanical structures for electronic equipment
Committee TC 91
Available for Purchase For sale in Singapore only
Adoption IEC : 0