IEC TR 61191-7:2020

Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

OVERVIEW

IEC TR 61191-7:2020(E) serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.

COMMENTS

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PRODUCT DETAILS

Status Current
Edition 2020
No. of Pages 115
ICS Classification 31.190 Electronic component assemblies
31.180 Printed circuits and boards
Committee TC 91
Available for Purchase For sale in Singapore only
Adoption IEC