FAQs
IEC 60749-27:2003
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge...
IEC 60749-26:2006
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge...
IEC 60749-26:2003
IEC 60749-21:2004
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60749-15:2003
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering...
IEC 60748-4:1987
Semiconductor devices. Integrated circuits. Part 4: Interface integrated circuits.
IEC 60748-4:1987/AMD2:1994
Amendment 2 - Semiconductor devices. Integrated circuits. Part 4: Interface integrated circuits.
IEC 60748-4:1987/AMD1:1991
Amendment 1 - Semiconductor devices. Integrated circuits. Part 4: Interface integrated circuits.
IEC 60748-22:1992
Semiconductor devices. Integrated circuits - Part 22: Sectional specification for film...