IEC PAS 62137-3:2008
Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
OVERVIEW
IEC/PAS 62137-3:2008(E) describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material.
COMMENTS
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PRODUCT DETAILS
| Status | |
|---|---|
| Edition | 2008 |
| No. of Pages | 41 |
| ICS Classification | 31.190 Electronic component assemblies |
| Committee | TC 91 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |