IEC 61188-1-2:1998
Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
OVERVIEW
The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.
COMMENTS
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PRODUCT DETAILS
| Status | Withdrawn - 02 Jan 2026 |
|---|---|
| Edition | 1998 |
| No. of Pages | 83 |
| ICS Classification | 31.180 Printed circuits and boards |
| Committee | TC 91 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |