IEC 60191-3A:1976
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - First supplement
OVERVIEW
Deals with design procedure for dimensions of integrated circuit packages, and rules for mounting integrated circuit packages into carriers.
COMMENTS
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PRODUCT DETAILS
| Status | Revised |
|---|---|
| Edition | 1976 |
| No. of Pages | 11 |
| ICS Classification | 01.100.20 Mechanical engineering drawings 31.080.01 Semiconductor devices in general |
| Committee | TC 47/SC 47D |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |