IEC 61189-3:1997+AMD1:1999 CSV
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
OVERVIEW
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods. This consolidated version consists of the first edition (1997) and its amendment 1 (1999). Therefore, no need to order amendment in addition to this publication.
COMMENTS
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PRODUCT DETAILS
| Status | Revised |
|---|---|
| Edition | 1999 |
| No. of Pages | 141 |
| ICS Classification | 31.180 Printed circuits and boards |
| Committee | TC 91 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |