IEC 60749-22:2002
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
OVERVIEW
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.
COMMENTS
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PRODUCT DETAILS
| Status | Withdrawn - 02 Jan 2026 |
|---|---|
| Edition | 2002 |
| No. of Pages | 41 |
| ICS Classification | 31.080.01 Semiconductor devices in general |
| Committee | TC 47 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |