IEC 60749-3:2002
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection
OVERVIEW
Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The contents of the corrigendum of August 2003 have been included in this copy.
COMMENTS
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PRODUCT DETAILS
| Status | Revised |
|---|---|
| Edition | 2002 |
| No. of Pages | 7 |
| ICS Classification | 31.080.01 Semiconductor devices in general |
| Committee | TC 47 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |