IEC 60749-34:2004
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
OVERVIEW
Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed causing rapid changes of temperature. The power cycling test is complementary to high temperature operating life.
COMMENTS
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PRODUCT DETAILS
| Status | Revised |
|---|---|
| Edition | 2004 |
| No. of Pages | 21 |
| ICS Classification | 31.080.01 Semiconductor devices in general |
| Committee | TC 47 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |