IEC 61249-3-5:1999

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

OVERVIEW

Gives requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.

COMMENTS

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PRODUCT DETAILS

Status Current
Edition 1999
No. of Pages 25
ICS Classification 31.180 Printed circuits and boards
Committee TC 91
Available for Purchase For sale in Singapore only
Adoption IEC