IEC 60191-6-1:2001
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
OVERVIEW
Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2001 |
| No. of Pages | 7 |
| ICS Classification | 31.080.01 Semiconductor devices in general |
| Committee | TC 47/SC 47D |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |