IEC 61189-3:1997/AMD1:1999
Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
OVERVIEW
COMMENTS
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PRODUCT DETAILS
| Status | Withdrawn - 02 Jan 2026 |
|---|---|
| Edition | 1999 |
| No. of Pages | 65 |
| ICS Classification | 31.180 Printed circuits and boards |
| Committee | TC 91 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |