IEC PAS 62184:2000
Lead integrity test method
OVERVIEW
Provides various tests for determining the integrity lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for reassembly.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2000 |
| No. of Pages | 16 |
| ICS Classification | 31.080.01 Semiconductor devices in general |
| Committee | TC 47 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |