IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
OVERVIEW
IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).
COMMENTS
-
PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2023 |
| No. of Pages | 16 |
| ICS Classification | 31.180 Printed circuits and boards |
| Committee | TC 91 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |