IEC 60749-15:2003
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
OVERVIEW
Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.
COMMENTS
-
PRODUCT DETAILS
| Status | Revised |
|---|---|
| Edition | 2003 |
| No. of Pages | 11 |
| ICS Classification | 31.080.01 Semiconductor devices in general |
| Committee | TC 47 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |