IEC 60749-40:2011
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
OVERVIEW
IEC 60749-40:2011 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test. This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2011 |
| No. of Pages | 44 |
| ICS Classification | 31.080.01 Semiconductor devices in general |
| Committee | TC 47 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |