IEC PAS 62174:2000
Resistance to soldering temperature for through-hole mounted devices
OVERVIEW
Determines whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.
COMMENTS
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PRODUCT DETAILS
| Status | |
|---|---|
| Edition | 2000 |
| No. of Pages | 5 |
| ICS Classification | 31.080.01 Semiconductor devices in general |
| Committee | TC 47 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |