IEC 60191-4:2013+AMD1:2018 CSV
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
OVERVIEW
IEC 60191-4:2013+A1:2018 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use. This consolidated version consists of the third edition (2013) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2018 |
| No. of Pages | 152 |
| ICS Classification | 31.080.01 Semiconductor devices in general |
| Committee | TC 47/SC 47D |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |