IEC 60749-21:2004
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
OVERVIEW
Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
COMMENTS
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PRODUCT DETAILS
| Status | Withdrawn - 02 Jan 2026 |
|---|---|
| Edition | 2004 |
| No. of Pages | 45 |
| ICS Classification | 31.080.01 Semiconductor devices in general |
| Committee | TC 47 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |