IEC 61249-8-8:1997
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
OVERVIEW
Provides requirements for the qualification of temporary solder resist coatings. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 1997 |
| No. of Pages | 19 |
| ICS Classification | 31.180 Printed circuits and boards |
| Committee | TC 91 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |