IEC PAS 62173:2000
Solderability test method
OVERVIEW
Provides a means of determining the solderability of device package terminations that are intended to be joined to another surface using solder for the attachment. Provides also optional conditions for ageing and soldering for the purpose of allowing simulation of the soldering process to be used in the device application.
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2000 |
| No. of Pages | 17 |
| ICS Classification | 31.080.01 Semiconductor devices in general |
| Committee | TC 47 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC : 0 |