IEC 60191-6-18:2010/COR1:2010
Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
OVERVIEW
COMMENTS
-
PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2010 |
| No. of Pages | 0 |
| ICS Classification | 31.080.01 Semiconductor devices in general |
| Committee | TC 47/SC 47D |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |