IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA
OVERVIEW
IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2021 |
| No. of Pages | 17 |
| ICS Classification | 31.180 Printed circuits and boards |
| Committee | TC 91 |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |