IEC 60191-6-2:2001/COR1:2002
Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
OVERVIEW
COMMENTS
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PRODUCT DETAILS
| Status | Current |
|---|---|
| Edition | 2002 |
| No. of Pages | 0 |
| ICS Classification | 31.080.01 Semiconductor devices in general |
| Committee | TC 47/SC 47D |
| Available for Purchase | For sale in Singapore only |
| Adoption | IEC |